We call this format E-MAP as we don't know what prober or test software it originates from. But a client needed support for it and we added read/write modules based on a single sample. The sample is shown below. Identifying strings have been modified.
WAFERID = X11111.01 wafer ID; likely includes LotID and Wafer number
TESTDATE = 2025/04/22 10:10:10 date and time wafer was tested
TESTLOC = TAIP test location
DEVICE = AA111 name of device tested
FABLOTID = XXXX9999999999 fabrication lot ID
WAFERLOTID = X11111 Lot ID
WAFERUNITS = inch Units - wafer diameter
WAFERSIZE = 6 Wafer diameter
DIEUNITS = microns Die Units
XDIESIZE = 4392.0 Die Width
YDIESIZE = 7011.0 Die Height
COLCT = 33 number of columns in array
ROWCT = 19 number of rows in array
BINTYPE = ASCII bin definitions, counts and status
BIN = 1;COUNT = 354;STATUS = PASS;DESCR = GOOD
BIN = A;COUNT = 78;STATUS = FAIL;DESCR = BAD
BIN = Z;COUNT = 1;STATUS = FAIL;DESCR = BAD
BIN = +;COUNT = 0;STATUS = FAIL;DESCR = SKIP
BIN = -;COUNT = 73;STATUS = FAIL;DESCR = INKED
BIN = .;COUNT = 121;STATUS = FAIL;DESCR = NO DIE
BINLIST = { start of map section
............----A----............
.......---A111A1AA11111---.......
......-1111111A11A1111111--......
....--1111111111111111111AA--....
...-A1111111111ZA1111A11111A1-...
..-111111111111A1111A111111111-..
.-AAA1111111111AA1111111111111--.
--AA1A11111111A11AA11111111AA11-.
-11AAA11A1111A1A1111111A1AA1A1A--
-1111111111111111A111111111111A1-
-11A11111-11111A-11111A111111-11-
--1A11111AA1111A11111111111111A--
.-A11111111111A111A11111111A111-.
.--A11111111111111111111111111--.
..-11AA111111A11AAA1111111111--..
...--AAA1111111111111A111A11--...
....--1A11A1A11-11111A11111--....
......--11111A11111111A1A--......
........---A1A111AA1AA---........
}